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US 8,941,219 B2Granted
Etched recess package on package system
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay, Jairus Legaspi Pisigan
Life of this patent
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Abstract
An integrated circuit package system includes: interconnection pads; a first device mounted below the interconnection pads; a bond wire, or a solder ball connecting the first device to the interconnection pads; a lead connected to the interconnection pad or to the first device; an encapsulation having a top surface encapsulating the first device; and a recess in the top surface of the encapsulation with the interconnection pads exposed therefrom.
Claims10
An integrated circuit package system comprising:
- a die pad;
- an interconnection pad coplanar with and spaced away from the die pad;
- a first device mounted on the die pad and below the interconnection pad;
- a bond wire or a solder ball in direct contact with the first device and in direct contact with the interconnection pad;
- a lead having a top planar surface and a bottom planar surface, the lead isolated from the interconnection pad and connected to the first device, the interconnection pad between the lead and the die pad;
- and
- an encapsulation having a top surface over the first device and a recess in the top surface of the encapsulation with the interconnection pad exposed within the recess, the interconnection pad in direct contact with the encapsulation, the interconnection pad separated from, the lead by the encapsulation, and the bottom planar surface above the interconnection pad.
4 more elements
Dependencies are inferred from the claim text.