Helical spiral inductor between stacking die

A multi-level integrated inductor, comprising:

• a first inductive structure comprising a first metal layer disposed in a first helical pattern on a first side of a first integrated chip (IC) die;
• a second inductive structure comprising a second metal layer disposed in a second helical pattern on a first side of a second IC die, which faces a first side of the first IC die;
• and
• a conductive interconnect structure located vertically between the first and second IC die and configured to electrically connect the first metal layer to the second metal layer.

A multi-level integrated inductor, comprising:

• a first inductive structure comprising a first conductive layer arranged in a first pattern onto a first side of a first integrated chip (IC) die;
• a second inductive structure located at a position vertically over the first inductive structure, and comprising a second conductive layer arranged in a second pattern that is a mirror image of the first pattern onto a first side of a second IC die facing the first side of the first IC die;
• and
• one or more micro-bumps disposed within an underfill layer vertically located between the first inductive structure and the second inductive structure.