US 8,941,202 B2 · Image sensor devices and methods for manufacturing the same

Abstract

A method for forming an image sensor device is provided. First, a lens is provided and a first sacrificial element is formed thereon. An electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens. A peripheral region of the selected portion of the lens remains exposed. A light-shielding layer is formed on the electromagnetic interference pattern, second sacrificial element, and peripheral region of the selected portion of the lens. The second sacrificial element and light-shielding pattern are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Claims9

Dependent claims

An image sensor device, comprising:

a photo sensor having a lens thereon;
an electromagnetic interference pattern on the lens, wherein the electromagnetic interference pattern has an opening exposing a portion of the lens, said opening defined by an inner sidewall of said electromagnetic interference pattern;
a light-shielding pattern abutting and covering a top surface and said inner sidewall of said electromagnetic interference pattern of the electromagnetic interference pattern, thereby defining a light transmitting region within the opening, wherein the light transmitting region is smaller than the opening.

Dependencies are inferred from the claim text.

Facts

Application

14/019,333Filed 5 Sep 2013 · division

Priority

4 Jun 2010

Published

US 2014/0001590 A12 Jan 2014

Granted

27 Jan 2015

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10F 77/40
Constructional details of devices covered by this subclass: optical elements or arrangements
H10F 39/024
Manufacture or treatment of image sensors covered by group H10F39/12: of coatings or optical elements
H10F 39/8057
Coatings: optical shielding
H10F 39/8063
Optical elements or arrangements associated with the image sensors: microlenses

Image sensor devices and methods for manufacturing the same

Life of this patent

Image sensor devices and methods for manufacturing the same

Life of this patent

Abstract

Claims9