Method for manufacturing a hybrid integrated component

A method for manufacturing a hybrid integrated component, having a MEMS element, a cap for the micromechanical structure of the MEMS element, and an ASIC substrate, the method comprising:

• manufacturing in a layered structure a micromechanical structure of the MEMS element and the cap for the micromechanical structure of the MEMS element, proceeding from a shared semiconductor substrate, by performing the following:
• applying at least one cap layer to a first surface of the semiconductor substrate, wherein at least one sacrificial layer is applied to the first surface of the semiconductor substrate and structured so that it forms a space holder for a cavity between the MEMS structure and the cap, and the at least one cap layer is applied over and contacts the at least one structured sacrificial layer on the first surface of the semiconductor substrate, and
• processing and structuring the semiconductor substrate proceeding from its other second surface, to produce and expose the micromechanical MEMS structure;
• and
• mounting the semiconductor substrate with the MEMS-structured second surface on the ASIC substrate.