Light-emitting element mounting package, light-emitting element package, and method of manufacturing the same

A method of manufacturing a light-emitting element mounting package, the method comprising:

• laminating a metallic layer on an insulating layer;
• forming a first wiring portion and a second wiring portion separated by a predetermined first gap, by removing predetermined portions of the metallic layer;
• forming a bus line for electrically connecting the plurality of the wiring portions;
• forming on the first wiring portion a first electroplating film and a second electroplating film separated by a predetermined second gap, and forming on the second wiring portion a third electroplating film and a fourth electroplating film separated by the predetermined second gap, said electroplating films being formed by electroplating using the bus line, and wherein the second electroplating film and the third electroplating film define a light-emitting element mounting area;
• removing the bus line after forming the light-emitting element mounting area;
• and
• forming a reflective film to cover an upper surface of the insulating layer, cover the predetermined second gap between the first electroplating film and the second electroplating film of the first wiring portion, and cover the predetermined second gap between the third electroplating film and the fourth electroplating film of the second wiring portion, the reflective film being further formed to include an opening portion through which the light-emitting element mounting area is exposed.

A light-emitting element mounting package comprising:

• an insulating layer;
• a first wiring portion and a second wiring portion formed on the insulating layer and separated by a predetermined first gap;
• a first electroplating film and a second electroplating film formed on the first wiring portion and separated by a predetermined second gap, the first electroplating film being formed on a first side of the first wiring portion, the second electroplating film being formed on a second side of the first wiring portion being opposite to the first side;
• a third electroplating film and a fourth electroplating film formed on the second wiring portion and separated by the predetermined second gap, the third electroplating film being formed on a first side of the second wiring portion, the fourth electroplating film being formed on a second side of the second wiring portion being opposite to the first side;
• a light-emitting element mounting area formed by the second electroplating film on the first wiring portion and the third electroplating film on the second wiring portion;
• and
• a reflective film which includes an opening portion through which the light-emitting element mounting area is exposed, covers an upper surface of the insulating layer, covers the predetermined second gap between the first electroplating film and the second electroplating film on the first wiring portion, and covers the predetermined second gap between the third electroplating film and the fourth electroplating film on the second wiring portion.