Light emitting diode package and method of manufacture
OwnerMordehai Margalitinventor
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Abstract
A light emitting diode (LED) device and packaging for same is disclosed. In some aspects, the LED is manufactured using a vertical configuration including a plurality of layers. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids design problems, including manufacturing complexities, costs and heat dissipation problems found in conventional LED devices. Some embodiments include a plurality of optically permissive layers, including an optically permissive cover substrate or wafer stacked over a semiconductor LED and positioned using one or more alignment markers.
Claims11
A light emitting device, comprising:
- a semiconductor LED including doped and intrinsic regions thereof;
- a conducting support layer disposed proximal to a first surface of said semiconductor LED and separated therefrom by a metallic interface with no additional intervening layers, said conducting support layer is no more than 50 microns in thickness;
- an optically permissive layer proximal to a second surface of said semiconductor LED, said first and second surfaces of said semiconductor LED being on opposing faces thereof;
- an optically definable material proximal to or within said optically permissive layer that affects an optical characteristic of emitted light passing therethrough;
- an optically permissive flat cover substrate covering at least a portion of the above components;
- and
- a metal pad between said semiconductor LED and said optically permissive layer,
- wherein, said first surface of said semiconductor LED, said metallic interface and said conducting support layer are all electrically coupled to one another.
A method for making a light emitting device, the method comprising:
- growing a plurality of doped layers in a light emitting device (LED) on a substrate;
- depositing a metallic interface onto said LED opposite to said substrate;
- electroplating a conductive support layer onto said metallic interface;
- lifting off said substrate from said LED;
- forming a metal pad on the newly exposed LED surface;
- etching a recess through said conductive support layer, said metallic interface and said LED so as to allow electrical contact with said metal pad and consequently a first doped layer of said LED;
- providing electrical contact to said conductive support layer and consequently to a second doped layer of said LED so as to bias the LED using a bias voltage applied between said first and second doped layers of the LED;
- and
- securing the LED to an optically permissive cover substrate using an optically permissive layer including an optically definable material through which light generated by said LED can pass.
Dependencies are inferred from the claim text.