US 8,941,129 B1 · Using an LED die to measure temperature inside silicone that encapsulates an LED array

Abstract

An LAM/ICM assembly comprises an integrated control module (ICM) and an LED array member (LAM). The ICM includes interconnect through which power from outside the assembly is received. In a first novel aspect, active circuitry is embedded in the ICM. In one example, the circuitry monitors LED operation, controls and supplies power to the LEDs, and communicates information into and out of the assembly. In a second novel aspect, a lighting system comprises an AC-to-DC converter and a LAM/ICM assembly. The AC-to-DC converter outputs a substantially constant current or voltage. The magnitude of the current or voltage is adjusted by a signal output from the LAM/ICM. In a third novel aspect, the ICM includes a switching DC-to-DC converter. An AC-to-DC power supply supplies a roughly regulated supply voltage. The switching converter within the LAM/ICM receives the roughly regulated voltage and supplies a regulated LED drive current to its LEDs.

Claims17

Dependent claims

An assembly comprising:

an integrated control module (ICM) that defines a central opening, wherein the central opening has a substantially circular upper peripheral edge and a substantially rectangular lower peripheral edge, wherein the substantially circular upper peripheral edge has smaller periphery than the substantially rectangular lower peripheral edge, wherein the ICM comprises at least one active electronic component;
and
an LED (Light Emitting Diode) array member (LAM) comprising a substrate member, a plurality of LED dice disposed on the substrate member, and an amount of luminescent material disposed over the LED dice, wherein the substrate member includes an interconnect layer and a plurality of LAM contact pads, wherein the LAM contact pads are disposed on an upper surface of the LAM, wherein the LAM fits up into the central opening in the ICM and is attached to the ICM, and wherein the LED dice are controlled by the active electronic component.

Dependencies are inferred from the claim text.

Using an LED die to measure temperature inside silicone that encapsulates an LED array

Life of this patent

Using an LED die to measure temperature inside silicone that encapsulates an LED array

Life of this patent

Abstract

Claims17