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US 8,941,109 B2Granted
Test output buffer functional output input, test output, enable input
AssigneeTexas Instruments Incorporated
InventorsLee D. Whetsel, Richard L. Antley
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Abstract
Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the die. The added test pads allow a tester to probe and test more circuits within the die simultaneously. Also, the added test pads contribute to a reduction in the amount of test wiring overhead traditionally required to access and test circuits within a die, thus reducing die size.
Claims3
A die of semiconductor material comprising:
- A. functional die pads formed at the periphery of the die;
- B. test die pads separate from the functional die pads;
- C. functional circuitry having functional input and output terminals;
- D. a functional input buffer having an input coupled with a functional die pad and an output coupled with a functional input terminal;
- E. a test circuit output buffer having an input coupled with an output terminal that is not coupled with a functional die pad, an output that is coupled with a test die pad, and an enable input;
- and
- F. an enable input buffer having an input coupled with an enable test die pad, and an output coupled with the enable input of the test circuit output buffer.
4 more elements
Dependencies are inferred from the claim text.