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US 8,941,017 B2Granted
Electronic apparatus, method of manufacturing substrate, and method of manufacturing electronic apparatus
AssigneeSeiko Epson Corporation
InventorYoji Nagano
Life of this patent
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Abstract
An electronic apparatus includes: a substrate which has a step portion in an edge portion; an electronic component which is bonded to a surface of the substrate inward of the step portion of the substrate; and a cap member which is bonded to the step portion so as to seal the electronic component, wherein a wall surface of the step portion is formed to be inclined from the step portion toward an electronic component bonding region or to be perpendicular to the step portion.
Claims5
An electronic apparatus comprising:
- a substrate which has a step portion in an edge portion;
- an electronic component which is bonded to a surface of the substrate inward of the step portion of the substrate;
- a cap member which is bonded to the step portion and a wall surface so as to seal the electronic component;
- and
- a metal layer disposed between the cap member and the substrate in a bonding region along the step portion and the wall surface,
- wherein part of the metal layer is placed on top of the surface of the substrate to which the electronic component is bonded, and
- wherein a wall surface of the step portion is formed to be inclined from the step portion toward an electronic component bonding region or to be perpendicular to the step portion.
4 more elements
Dependencies are inferred from the claim text.