US 8,941,016 B2 · Laminated wiring board and manufacturing method for same

Abstract

A laminated wiring board, includes: a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the insulating layer, and conductors are formed in via holes that pass through the insulating layer and the adhesive layer so that the conductor circuit is partially exposed therefrom; an electronic component electrically connected to the conductor circuit by allowing electrodes of the electronic component to be connected to the conductors; an embedding member arranged around the electronic components so that the electronic component is embedded therein; and a second substrate having an adhesive layer laminated to face the adhesive layer of the first substrate and sandwich the electronic component and the embedding member, wherein each of the electrodes of the electronic component is continuous with the conductor circuit through two or more of the conductors.

Claims11

Dependent claims

A laminated wiring board, comprising:

a first substrate in which a conductor circuit is formed on one surface of an insulating layer and an adhesive layer is formed on an other surface of the insulating layer, and conductors are respectively formed in a plurality of via holes that pass through the insulating layer and the adhesive layer so that the conductor circuit is partially exposed therefrom;
an electronic component electrically connected to the conductor circuit by allowing electrodes of the electronic component to be connected to the conductors, respectively;
an embedding member arranged around the electronic components so that the electronic component is embedded therein;
and
a second substrate having an adhesive layer laminated so as to face the adhesive layer of the first substrate and sandwich the electronic component and the embedding member,
wherein each of the electrodes of the electronic component is continuous with the conductor circuit through two or more of the conductors.

3 more elements

A manufacturing method for a laminated wiring board, comprising the steps of:

forming via holes in an insulating layer in which a conductor circuit is formed on one surface thereof and an adhesive layer is formed on an other surface thereof, such that two or more of the via holes are provided for each electrode at locations connected to the electrodes of the electronic component, the via holes passing through the adhesive layer and the insulating layer so that the conductor circuit is partially exposed therefrom;
forming a first substrate in which two or more conductors continuous with each of the electrodes of the electronic component are formed by filling the respective via holes with a conductive paste;
and
sandwiching the electronic component and an embedding member embedding the electronic component therein between a second substrate and the first substrate having adhesive layers, respectively, so that the adhesive layers face each other, laminating the first substrate and the second substrate so that each of the electrodes is connected to two or more of the conductive paste, the conductive paste being formed in the first substrate, and then integrally joining the laminated body by thermal compression bonding.

1 more element

Dependencies are inferred from the claim text.

Laminated wiring board and manufacturing method for same

Life of this patent

Laminated wiring board and manufacturing method for same

Life of this patent

Abstract

Claims11