Multilayer laminated structure for plug and connector with spring finger interconnecting feature

A method for forming a connector receptacle, the method comprising:

• arranging one or more contacts on a first layer, the first layer comprising a conductive layer and a substrate layer, wherein the one or more contacts are configured to communicate electrical signals between the conductive layer and a connector plug;
• forming a cavity along an edge of a pre-impregnation (prepreg) layer, the cavity being defined at least in part by a chamfered surface that is configured to be coupled with a chamfered edge of the connector plug;
• disposing a metal plating layer at least along the edge of the prepreg layer, wherein the metal plating layer is configured to aid in aligning the one or more contacts on the first layer with one or more contacts of the connector plug when the connector plug is engaged within the cavity;
• bonding the first layer to a first surface of the prepreg layer;
• and
• bonding a second layer to a second surface of the prepreg layer, wherein the second surface of the prepeg layer is positioned to oppose the first surface of the prepeg layer.

A system for establishing an electrical connection between multiple device components of the system, the system comprising:

• a plug assembly having a first plug with at least one electrical contact and a second plug with at least one electrical contact, wherein the plug assembly is configured to transmit electrical signals between the at least one electrical contact of the first plug and the at least one electrical contact of the second plug;
• a first connector component including a first connector receptacle;
• and
• a second connector component including a second connector receptacle, wherein the first connector receptacle and second connector receptacle each comprise:
• a pre-impregnation (prepreg) layer,
• a first layer disposed along and in contact with a first surface of the prepreg layer, the first layer comprising a conductive layer and a substrate layer, wherein a portion of the conductive layer is disposed between the substrate layer and the prepreg layer,
• a second layer disposed along and in contact with a second surface of the prepreg layer,
• a cavity defined at least in part by a plurality of surfaces of the prepreg layer, the plurality of surfaces defining a chamfered geometry shaped to mate with a geometry of the first plug or the second plug of the plug assembly to restrict movement of the first plug or the second plug along a plane parallel to the prepreg layer when the first plug or the second plug of the plug assembly is engaged within the cavity,
• at least one contact disposed on the first layer and configured to transmit or receive electrical signals between the conductive layer and the first plug or the second plug when the first plug or the second plug of the plug assembly is engages within the cavity, and
• a metal plating layer disposed along the plurality of surfaces of the prepreg layer defining the chamfered geometry, wherein the metal plating layer is configured to aid in aligning the at least one contact disposed on the first layer and the at least one electrical contact of the first plug or the at least one electrical contact of the second plug when the first plug or the second plug of the plug assembly is engaged within the cavity.

A printed circuit board, comprising:

• a dielectric substrate, having an edge portion defining a chamfered notch, the chamfered notch having at least one chamfered edge that causes a width of the chamfered notch to narrow as the chamfered notch extends into the dielectric substrate;
• a first layer coupled with a top surface of the dielectric substrate and disposed above the chamfered notch, the first layer comprising a plurality of electrical contacts disposed along a bottom surface of the first layer;
• a second layer coupled with a bottom surface of the dielectric substrate and disposed below the chamfered notch, wherein the first layer and the second layer are arranged relative to the chamfered notch of the dielectric substrate to define a cavity having a size and a shape corresponding to a mating portion of a communication connector, and
• a metal plating layer disposed along a surface of the edge portion of the dielectric substrate that defines at least a portion of the chamfered notch, wherein the metal plating layer is configured to aid in aligning the plurality of electrical contacts disposed along a bottom surface of the first layer with one or more electrical contacts of the communication connector when the mating portion of the communication connector is engaged within the cavity.