Partially aromatic polyamide moulding compositions and their uses

A polyamide moulding composition having the following composition:

• (A) 62-87% by weight of a partially aromatic, partially crystalline copolyamide having a melting point of 270° C. to 320° C. and made up of:
• 100% by weight of diacid fraction composed of:
• 50-100% by weight of a diacid selected from the group consisting of:
• terephthalic acid, naphthalenedicarboxylic acid, and mixtures thereof;
• and
• 0-50% by weight of isophthalic acid;
• and 100% by weight of diamine fraction composed of:
• 10-80% by weight selected from the group consisting of butanediamine, pentanediamine, hexanediamine or a mixture thereof;
• and
• 20-90% by weight selected from the group consisting of methyloctanediamine, nonanediamine, decanediamine, undecane-diamine and dodecanediamine or a mixture thereof;
• (B) 9-15% by weight of an ionomer selected from ionomers based on the group of systems consisting of:
• ethylene-(meth)acrylic acid and ethlyene-(meth)acrylic acid-n-butyl acrylate;
• (C) 8-18% by weight of flame retardants;
• and
• (D) 0-5% by weight of additives;
• where the components (A)-(D) add up to 100% by weight, and
• wherein the polyamide moulding composition is free of fibrous reinforcing material and has an elongation at break of at least 5%.