Method of making wire bond vias and microelectronic package having wire bond vias

A method of forming a plurality of wire bonds connected to a substrate, comprising:

• (a) positioning at least one of:
• a bonding tool and a portion of a wire extending downward beyond a face thereof;
• or a forming surface relative to one another such that an end of the wire portion extending downward beyond a face of the bonding tool is positioned at a greater depth from the bonding tool face than the forming surface;
• (b) then moving the bonding tool along the first forming surface in a first direction parallel to the face of the bonding tool so as to bend the wire portion towards the bonding tool;
• (c) then moving the bonding tool in a second direction transverse to the bonding tool face such that an exposed wall of the bonding tool extending away from the bonding tool face confronts a second forming surface extending away from the first forming surface, whereby the wire portion is bent towards the exposed wall of the bonding tool;
• (d) coining a part of the wire portion between the bonding tool face and a coining surface;
• (e) using the bonding tool to bond the coined part of the wire portion to an electrically conductive bonding surface of the substrate to form a wire bond, while leaving unbonded the end of the wire portion remote from the coined part;
• and
• (f) repeating steps (a) through (e) to form a plurality of the wire bonds to at least one of the bonding surface.