Ball grid array semiconductor package and method of manufacturing the same
AssigneeSeiko Instruments Inc.
InventorNoriyuki Kimura
Life of this patent
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Abstract
In a method of manufacturing a ball grid array (BGA) semiconductor package, micro balls are mounted onto a respective plurality of through-holes formed in a substrate, and a semiconductor device is mounted on a die pad portion of the substrate. The semiconductor device and the micro balls are electrically connected with bonding wires. The semiconductor device, the die pad portion, the bonding wires, and parts of the micro balls are sealed together with an insulating resin to form an encapsulation member. The encapsulation member and the substrate are then cut into individual BGA semiconductor packages.
Claims20
A method of manufacturing a ball grid array (BGA) semiconductor package, comprising:
- forming a plurality of through-holes in a region of a substrate;
- mounting micro balls in the plurality of through-holes formed in the substrate;
- bonding a semiconductor device on a die pad portion of the substrate arranged in a region of the substrate excluding the region thereof in which the plurality of through-holes are formed, the region in which the die pad is arranged being provided on a side of the substrate on which the micro balls are mounted;
- electrically connecting the semiconductor device and the micro balls by with bonding wires;
- encapsulating the semiconductor device, the die pad portion, the bonding wires, and parts of the micro balls together with an encapsulation resin, to thereby form an encapsulation member;
- and
- cutting the encapsulation member and the substrate into individual pieces of BGA semiconductor packages.
A method of manufacturing a ball grid array (BGA) semiconductor package, comprising:
- forming a plurality of through-holes in a substrate having an upper surface side and a lower surface side;
- adhering a UV tape to the lower surface side of the substrate;
- fixing a plurality of micro balls into the respective plurality of through-holes from the upper surface side of the substrate using an adhesive of the UV tape;
- bonding a semiconductor device on a die pad portion of the substrate arranged in a region of the upper surface side of the substrate excluding a region of the substrate in which the plurality of through-holes are formed;
- electrically connecting the semiconductor device and the micro balls with bonding wires;
- encapsulating the semiconductor device, the die pad portion, the bonding wires, and parts of the micro balls together with an encapsulation resin, to thereby form an encapsulation member;
- and
- cutting the encapsulation member into individual pieces of BGA semiconductor packages.
A method of manufacturing a ball grid array (BGA) semiconductor package, comprising:
- mounting a plurality of micro balls onto a respective plurality of through-holes formed in a substrate;
- mounting a semiconductor device on a die pad portion of the substrate;
- electrically connecting the semiconductor device and the micro balls with bonding wires;
- sealing the semiconductor device, the die pad portion, the bonding wires, and parts of the micro balls together with an insulating resin to form an encapsulation member;
- and
- cutting the encapsulation member and the substrate into individual BGA semiconductor packages.
Dependencies are inferred from the claim text.