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US 8,940,622 B2Granted
Method for manufacturing compound semiconductor device and detergent
AssigneeFujitsu Limited
InventorJunichi Kon
Life of this patent
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Abstract
A method for manufacturing a compound semiconductor device, the method includes: forming a compound semiconductor laminated structure; removing a part of the compound semiconductor laminated structure, so as to form a concave portion; and cleaning the inside of the concave portion by using a detergent, wherein the detergent contains a base resin compatible with residues present in the concave portion and a solvent.
Claims8
A method for manufacturing a compound semiconductor device, the method comprising:
- forming a compound semiconductor laminated structure;
- removing a part of the compound semiconductor laminated structure, so as to form a concave portion;
- and
- cleaning the inside of the concave portion by using a detergent,
- wherein the detergent contains a base resin compatible with residues present in the concave portion and a solvent.
2 more elements
Dependencies are inferred from the claim text.