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US 8,940,621 B2Granted
Methods of forming semiconductor modules including flexible panels
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Uk Han, Jeong-Kyu Ha, Youngshin Kwon, Seung Hwan Kim, KwanJai Lee
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Abstract
Provided are methods of forming semiconductor modules. The method includes forming a high polymer material layer having an adhesive property on a support substrate, adhering a semiconductor chip to the support substrate using the high polymer material layer, bonding the semiconductor chip adhered to the support substrate to a flexible panel, and removing the support substrate.
Claims10
A method of forming a semiconductor module, comprising:
- forming a high polymer material layer having an adhesive property on a support substrate;
- adhering a plurality of semiconductor chips to the support substrate using the high polymer material layer;
- cutting the support structure substrate and the high polymer material layer to separate the plurality of semiconductor chips from each other;
- bonding the semiconductor chip adhered to the support substrate to a flexible panel;
- and
- removing the support substrate.
3 more elements
Dependencies are inferred from the claim text.