Method of diced wafer transportation
AssigneeApplied Materials, Inc.
InventorsWei-Sheng Lei, Brad Eaton, Aparna Iyer, Saravjeet Singh, Todd Egan, Ajay Kumar, Seshadri Ramaswami
Life of this patent
Estimating the term…
Abstract
Methods of dicing semiconductor wafers, and transporting singulated die, are described. In an example, a method of dicing a wafer having a plurality of integrated circuits thereon involves dicing the wafer into a plurality of singulated dies disposed above a dicing tape. The method also involves forming a water soluble material layer over and between the plurality of singulated dies, above the dicing tape.
Claims15
A method of dicing a wafer having a plurality of integrated circuits thereon, the method comprising:
- dicing the wafer into a plurality of singulated dies disposed above a dicing tape;
- and
- forming a water soluble material layer over and between the plurality of singulated dies, above the dicing tape.
A method of dicing a wafer having a plurality of integrated circuits thereon, the method comprising:
- forming a water soluble mask layer above the wafer, the wafer disposed above a dicing tape;
- scribing the water soluble mask layer with a laser scribing process to expose portions of the wafer;
- etching the exposed portions of the wafer with a plasma process to dice the wafer into a plurality of singulated dies;
- and
- forming a water soluble protecting layer over and between the plurality of singulated dies, above the dicing tape.
Dependencies are inferred from the claim text.