Method and device for cutting semiconductor wafers
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien Ling Hwang, Lin-Wei Wang, Chung-Shi Liu
Life of this patent
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Abstract
A method for cutting a semiconductor wafer into semiconductor chips that reduces defects at the semiconductor chip corners. The method includes a pre-cutting processing step of trimming the semiconductor chip corners so that mechanical stress is reduced at the corners. The method includes dicing channels on a semiconductor wafer thereby defining the geometrical shape of one of the semiconductor chips, modifying the corners of the one of the semiconductor chips, and cutting the semiconductor wafer to separate the one of the semiconductor chips from other semiconductor chips.
Claims20
A cutting method of separating semiconductor chips, comprising:
- creating dicing channels on a semiconductor wafer, the dicing channels at least partially defining a geometrical shape of the semiconductor chips, the geometrical shape of the semiconductor chips having one or more corners;
- removing at least one corner of the one or more corners of the semiconductor chips with a drill by moving the drill laterally in a circular path, the circular path being in a plane parallel to a surface of the semiconductor wafer;
- and
- cutting along the dicing channels to separate the semiconductor chips after removing the at least one corner of the one or more corners.
Dependencies are inferred from the claim text.