Stackable electronic package and method of fabricating same

A method of fabricating an electronic package, the method comprising:

• forming a plurality of die package sub-layers, each sub-layer having a first surface and a second surface, wherein forming each sub-layer comprises:
• providing a device having one or more electrical nodes;
• adhering the device to a flex layer, on a first surface of the sub-layer;
• forming a via through the flex layer at a location adjacent each of the one or more electrical nodes;
• forming a metallization layer that provides a direct metallic connection to each of the one or more electrical nodes, the metallization layer extending down through the via adjacent each of the one or more electrical nodes;
• forming contact pads on the metallization layer such that the contact pads are located on the second surface of the sub-layer
• providing a conductor on the first surface of the sub-layer;
• and
• electrically connecting the conductor to an electrical node of the device via the metallization layer, the metallization layer comprising a feed-thru extending through the flex layer to electrically connect the metallization layer to the conductor ;
• and
• compressing an anisotropic conductive paste (ACP) between the plurality of sub-layers such that the contact pad of one sub-layer is electrically connected to the conductor of an adjacent sub-layer via the ACP, wherein the ACP comprises a plurality of solder balls that conduct electrical signals.