Method of fabricating an integrated orifice plate and cap structure
AssigneeHewlett-Packard Development Company, L.P.
InventorsDaniel A Kearl, Rio Rivas
Life of this patent
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AssigneeHewlett-Packard Development Company, L.P.
InventorsDaniel A Kearl, Rio Rivas
Estimating the term…
In an embodiment, a method of fabricating an integrated orifice plate and cap structure includes forming an orifice bore on the front side of a product wafer, coating side walls of the orifice bore with a protective material, grinding the product wafer from its back side to a final thickness, forming a first hardmask for subsequent cavity formation, forming a second hardmask over the first hardmask for subsequent descender formation, forming a softmask over the second hardmask for subsequent convergent bore formation, etching a latent convergent bore using the softmask as an etch delineation feature, etching a descender using the second hardmask as an etch delineation feature, and anisotropic etching of convergent bore walls and cavities using the first hardmask as an etch delineation feature.
A method comprising:
Dependencies are inferred from the claim text.