Method of fabricating wafer level package
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-won Kim, Jong-youn Kim, Eun-kyoung Choi, Sang-uk Han, Ji-seok Hong
Life of this patent
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Abstract
A method of fabricating a wafer level package includes preparing a wafer including a plurality of first semiconductor chips, mounting a plurality of second semiconductor chips on the wafer, disposing the wafer on a lower mold and disposing an upper mold so as to surround edges of a top surface of the wafer, dispensing a molding member on the wafer, and pressurizing the molding member by using a plunger so as to fabricate a wafer level package in which a top surface of each of the plurality of second semiconductor chips is exposed.
Claims17
A method of fabricating a wafer level pacakge, the method comprising:
- preparing a wafer including a plurality of first semiconductor chips;
- mounting a plurality of second semiconductor chips on the wafer;
- disposing the wafer on a lower mold and disposing an upper mold so as to surround edges of a top surface of the wafer;
- dispensing a molding member on the wafer;
- and
- pressurizing the molding member by using a plunger so as to fabricate a wafer level package in which a top surface of each of the plurality of second semiconductor chips is exposed.
A method of fabricating a wafer level package, the method comprising:
- mounting a plurality of second semiconductor chips on a wafer;
- disposing the wafer on a lower mold and disposing an upper mold so as to surround edges of a top surface of the wafer such that a molding process is performed;
- dispensing a molding member on the wafer;
- and
- performing a compression process using a plunger on the dispensed molding member so as to fabricate a wafer level package in which a top surface of each of the plurality of second semiconductor chips is exposed.
A method of fabricating a wafer level package such that a top surface of a plurality of semiconductor chips of the wafer level package is exposed without performing a grinding process, the method comprising:
- calculating a predetermined amount of a molding member according to the volume of space between the plurality of semiconductor chips;
- disposing the predetermined amount of molding member within in a mold on a top surface of the wafer level package;
- and
- shaping the molding member such that the top surface of the plurality of semiconductor chips is exposed.
Dependencies are inferred from the claim text.