Maintaining laminate flatness using magnetic retention during chip joining

A method of preventing laminate warpage, the method comprising:

• placing a laminate on a back plate;
• and
• applying a magnetic force to the laminate comprising:
• placing a first magnet above the laminate;
• and
• placing a second magnet above the first magnet, wherein a repulsive force generated between the first magnet and the second magnet pushes the first magnet against the laminate, thereby holding the laminate flat against the back plate.

A method of preventing laminate warpage during a chip-joining process, the method comprising:

• placing a laminate on a back plate, wherein the back plate contains a ferromagnetic region;
• placing a microelectronic chip above the laminate;
• placing a plurality of solder balls between the microelectronic chip and the laminate;
• and
• placing a magnet carrier on the laminate, wherein the magnet carrier comprises a plurality of carrier legs and a magnet held above laminate by the plurality of carrier legs,
• wherein an attractive force generated between the magnet of the magnet carrier and the ferromagnetic region of the base plate pulls the magnet carrier against the laminate.

A method of preventing laminate warpage during a chip-joining process, the method comprising:

• placing a laminate on a back plate;
• placing a microelectronic chip above the laminate;
• placing a plurality of solder balls between the microelectronic chip and the laminate;
• placing a first magnet above the laminate;
• and
• placing a second magnet above the first magnet, where a repulsive force generated between the first magnet and the second magnet pushes the first magnet against the laminate.