Alloy wire and methods for manufacturing the same

#This Application claims priority of Taiwan Patent Application No. 101100014, filed on Jan. 2, 2012, the entirety of which is incorporated by reference herein.

#1. Field of the Invention

#The invention relates to alloy wires and manufacturing methods thereof, and more specifically to alloy wires utilized for wire bonding of packages of electronic devices and manufacturing methods thereof.

#The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:

#FIGS. 1A, 1B and 1C show an alloy wire of a first embodiment of the invention, wherein FIG. 1A schematically shows a segment of the alloy wire of the first embodiment of the invention, FIG. 1B is a lengthwise cross-section of the alloy wire shown in FIG. 1A along a direction parallel to the longitudinal direction of the alloy wire shown in FIG. 1A, and FIG. 1C is a transverse cross-section of the alloy wire shown in FIG. 1A along a direction perpendicular to the longitudinal direction of the alloy wire shown in FIG. 1A;

#FIGS. 2A, 2B and 2C show an alloy wire of a second embodiment of the invention, wherein FIG. 2A schematically shows a segment of the alloy wire of the second embodiment of the invention, FIG. 2B is a lengthwise cross-section of the alloy wire shown in FIG. 2A along a direction parallel to the longitudinal direction of the alloy wire shown in FIG. 2A, and FIG. 2C is a transverse cross-section of the alloy wire shown in FIG. 2A along a direction perpendicular to the longitudinal direction of the alloy wire shown in FIG. 2A;

#The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.

#Note that the concepts and specific practice modes of the invention is described in detail by the embodiments and the attached drawings. In the drawings or description, similar elements are indicated by similar reference numerals and/or letters. Further, the element shape or thickness in the drawings can be expanded for simplification or convenience of indication. Moreover, elements which are not shown or described can be in every form known by those skilled in the art.

#It is understood that the following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, Note that merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples.