Textured silicon substrate and method
AssigneeE. I. Du Pont de Nemours and Company
InventorsSeung Jin Lee, Hee Soo Yeo
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Abstract
A method of texturizing a silicon substrate comprising a) contacting the substrate with an etching solution comprising glycolic acid, b) etching a surface of the substrate thereby forming disruptions in said surface of the substrate, and c) removing the etching solution to yield a texturized substrate, said texturized substrate having a plurality of disruptions in at least one surface with a surface density of disruptions of a minimum of 60 disruptions in a 400 micron square area.
Claims11
A method of texturizing a silicon substrate comprising a) contacting the substrate with an acidic etching solution consisting of hydrofluoric acid, nitric acid, water, and about 4% to about 40% by weight of glycolic acid, b) etching a surface of the substrate thereby forming disruptions in said surface of the substrate, and c) removing the etching solution to yield a texturized substrate.
Dependencies are inferred from the claim text.