Electronic part manufacturing method and electronic part manufactured by the method

A method for manufacturing an electronic part comprising the steps of:

• applying a functional material ink, which is selected from the group consisting of a conductive ink, an insulating ink, a semiconductor ink, and a protective film forming ink, to a mold releasing surface of a transfer plate;
• forming an ink pattern layer by a relief offset method in which a relief plate is pressed on the functional material ink coated surface to remove the ink in a portion contacting the relief plate from the transfer plate, the ink pattern layer corresponding to a portion not contacting the relief plate;
• forming a composite ink as the ink pattern layer including the functional material ink pattern layer and a layer of a different functional material ink that is laminated on the ink pattern layer and provided in parallel with the ink pattern layer so that the two layer are not mixed with each other, the different functional material ink being selected from the group consisting of a conductive ink, an insulating ink, a semiconductor ink, and protective film forming ink;
• and
• reversely transferring the composite ink pattern layer to a printing object from the releasing surface of the transfer plate in such a manner that the outermost surface of the composite ink pattern layer faces the printing object.