Wafer mount device and manufacturing method thereof
AssigneeNGK Insulators, Ltd.
InventorNorifumi Shimazu
Life of this patent
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Abstract
An adhesive layer that bonds the back surface of a plate capable of attracting a wafer and the front surface of a cooling plate together that includes a main adhesive portion, which is made of a hardened matter of a fluid adhesive, and an outer peripheral adhesive portion, gas-supply-hole adhesive portions, lift-pin-hole adhesive portions, and terminal-hole adhesive portions made of a double-faced tape. The tape portions bond the outer peripheral edge on the back surface of the plate and the outer peripheral edge on the front surface of the cooling plate together, and the outer peripheral edges of the holes on the back surface of the plate and the outer peripheral edges of these holes on the front surface of the cooling plate together.
Claims5
A manufacturing method of a wafer mount device, the method comprising:
- (a) a step of preparing a disk-shaped ceramic plate including an electrostatic chuck electrode, and a disk-shaped metal cooling plate having an injection hole and a through hole penetrating through the cooling plate in a thickness direction;
- (b) a step of, after the step (a), bonding an outer peripheral edge on a back surface of the plate and an outer peripheral edge on a front surface of the cooling plate together by a double-faced tape, bonding the back surface of the plate and an outer peripheral edge of the through hole on the front surface of the cooling plate together by a double-faced tape, and hence providing a temporary bonded member;
- (c) a step of, after the step (b), injecting a fluid adhesive into a space of the temporary bonded member through the injection hole, the space being surrounded by the back surface of the plate, the front surface of the cooling plate, and the double-faced tapes;
- and
- (d) a step of, after the step (c), hardening the fluid adhesive.
Dependencies are inferred from the claim text.