Cleaning composition for temporary wafer bonding materials
AssigneeBrewer Science Inc.
InventorsXing-Fu Zhong, John Moore
Life of this patent
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Abstract
A cleaning composition for removing temporary wafer bonding material is provided. The cleaning composition comprises an alkylarylsulfonic acid and an aliphatic alcohol dispersed or dissolved in a hydrocarbon solvent system. Methods of separating bonded substrates and cleaning debonded substrates using the cleaning composition are also provided. The invention is particularly useful for temporary bonding materials and adhesives. The methods generally comprise contacting the bonding material with the cleaning solution for time periods sufficient to dissolve the desired amount of bonding material for separation and/or cleaning of the substrates.
Claims23
A method of removing a bonding material from a substrate surface, said method comprising:
- providing a first substrate having a surface with the bonding material thereon;
- and
- contacting said bonding material with a cleaning composition to thereby remove at least a portion of said bonding material from said substrate surface, said cleaning composition comprising an alkylarylsulfonic acid and from about 2 to 15% by weight of an aliphatic alcohol, based upon the total weight of the composition taken as 100% by weight, dispersed or dissolved in a hydrocarbon solvent system, wherein said aliphatic alcohol is selected from the group consisting of ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-1-propanol, 2-methyl-2-propanol, allyl alcohol, 2-butyn-1-ol, 3-butyn-1-ol, 3-butyn-2-ol, 3-buten-1-ol, 3-buten-2-ol, 1-pentanol, 2-pentanol, 1-hexanol, and mixtures thereof.
Dependencies are inferred from the claim text.