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US 8,940,102 B2Granted
Methods of removing particles from over semiconductor substrates
AssigneeMicron Technology, Inc.
InventorsNeil Joseph Greeley, Dan Millward, Wayne Huang
Life of this patent
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Abstract
Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.
Claims7
A method of removing particles from over a surface of a semiconductor substrate, comprising:
- flowing a liquid across the surface of the substrate and the particles, the liquid having thickness over the substrate, a first region of the thickness being near the substrate and comprising particles, a second region of the thickness being further from the substrate than the first region and having more flow than the first region;
- while the liquid is flowing, imparting an electric field across at least a region of the surface from electrodes spaced apart from one another and configured to form an electric field across at least the first region of the substrate, wherein the semiconductor substrate has a primary horizontal surface, and wherein at least a majority of the electric field is oriented substantially normal to said primary horizontal surface;
- and
- inducing movement of the particles form the first region to the second region using the electric field, wherein
- the electric field is provided for a duration;
- the electric field is maintained with an alternating current for part of the duration;
- the electric field is maintained with a direct current for another part of the duration.
4 more elements
Dependencies are inferred from the claim text.