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US 8,939,815 B2Granted
Systems providing an air zone for a chucking stage
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHui-Ting Tsai, Feng-Inn Wu
Life of this patent
Estimating the term…
Abstract
A system includes a chuck with a retaining ring on a first surface thereof. The first surface and the retaining ring are both circular, the retaining ring having a first inner circumference. The system also includes a platen with a second surface, and the second surface faces the first surface and is operable to move with the first surface. The system further includes an air zone circumscribed by the first inner circumference that provides an effective inner circumference different from the first inner circumference.
Claims19
A system comprising:
- a chuck with a retaining ring on a first surface thereof, the first surface and the retaining ring being circular, the retaining ring having a first inner circumference;
- a platen with a second surface, the second surface facing the first surface and operable to move with the first surface;
- and
- a port within the retaining ring, an opening of the port positioned to direct air at a circumferential edge of a wafer being secured by the chuck, the air forming an air zone circumscribed by the first inner circumference and providing an effective inner circumference different from the first inner circumference, the effective inner circumference being between the retaining ring and the wafer.
1 more element
A system comprising:
- a chuck that has a vacuum system effective on a contact surface to hold a manufactured object to the chuck;
- a retaining ring defining an area for holding the manufactured object to the contact surface, the retaining ring having a first inner circumference;
- and
- a port having an opening to direct air perpendicular to a circumferential edge of a wafer within the chuck, the port to apply pressurized air from the first inner circumference to reduce the first inner circumference to an effective inner circumference during a manufacturing process, the effective inner circumference being smaller than the first inner circumference, the effective inner circumference being between the retaining ring and the wafer.
1 more element
A system comprising:
- a chuck;
- a retaining ring on a first surface of the chuck, the first surface and the retaining ring being circular, the retaining ring having a first inner circumference;
- a platen with a second surface, the second surface facing the first surface and operable to move with the first surface;
- and
- a port to provide air through the retaining ring, the air to be directed at a space between the first inner circumference and circumferential edges of a wafer placed within the chuck, the air providing an effective inner circumference different from the first inner circumference, the effective inner circumference being between the retaining ring and the wafer.
2 more elements
Dependencies are inferred from the claim text.