Primary circuit board non-conductive void having different planar dimensions through board thickness to secure non-conducting locking member of holder

A circuit board comprising:

• a substrate having a front surface, a back surface, and a thickness defined from the front surface to the back surface;
• a conductive part receptive to conductive affixing to a conductive part of a secondary circuit board holder;
• and
• a non-conductive void having first planar dimensions through a first portion of the thickness from the front surface to a position between the front surface and the back surface, and having second planar dimensions through a second portion of the thickness from the position at least towards the back surface, the first planar dimensions different than the second planar dimensions,
• wherein the non-conductive void is receptive to insertion of a non-conducting locking member of the secondary circuit board holder to secure the secondary circuit board while the conductive part of the secondary circuit board holder is conductively affixed to the conductive part of the circuit board,
• wherein the substrate has an intermediate surface at the position that is parallel to the front surface and the back surface, the non-conducting locking member to secure the holder to the substrate between the front surface and the intermediate surface of the substrate.

A method comprising:

• configuring a non-conducting locking member of a secondary circuit board holder into an insertion state;
• while the non-conducting locking member is in the insertion state, inserting the non-conducting locking member into a non-conductive void of a primary circuit board having a front surface and a back surface, the non-conductive void having first planar dimensions through a first portion of a thickness of the primary circuit board extending from the front surface to a position between the front surface and the back surface, and having second planar dimensions through a second portion of the thickness extending from the position at least towards the back surface, the first planar dimensions different than the second planar dimensions;
• once the non-conducting locking member has been inserted into the non-conductive void, configuring the non-conducting locking member into a locking state in which the secondary circuit board holder is secured to the front surface of the primary circuit board;
• and
• while the non-conducting locking member is in the locking state, conductively affixing a conductive part of the secondary circuit board holder to a conductive part of the primary circuit board,
• wherein configuring the non-conducting locking member into the insertion state comprises compressing a plurality of fingers of the non-conductive locking member that have flared ends against one another such that the flared ends fit the non-conductive void at the first planar dimensions,
• and wherein configuring the non-conducting locking member into the locking state comprises releasing the fingers of the non-conducting locking member so that the fingers are no longer compressed against one another and instead define a gap therebetween such that the flared ends no longer fit the non-conductive void at the first planar dimensions.