Test socket having a housing with clamping devices to connect the housing to a floating guide
AssigneeSamsung Electronics Co., Ltd.
InventorsSangki Lee, Insik Kim, Teaseog Um, Suklae Kim, Yoonoh Han
Life of this patent
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Abstract
A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.
Claims20
A semiconductor chip package test socket, comprising:
- a socket housing;
- a plurality of probe needles in the socket housing;
- a conductive pad on the probe needles;
- a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad;
- and
- clamps fixed at the socket housing;
- wherein the clamps combine the floating guide with the socket housing.
A semiconductor chip package test socket, comprising:
- a socket housing;
- a plurality of probe needles associated with the socket housing;
- a conductive pad configured to contact the probe needles;
- a floating guide configured to cover an edge of the conductive pad and configured to align a semiconductor chip package with the conductive pad;
- and
- a plurality of devices associated with the socket housing that are configured to connect the floating guide to the socket housing.
A semiconductor chip package test socket, comprising:
- a socket housing;
- a plurality of probe needles associated with the socket housing;
- a conductive pad on the probe needles;
- a floating guide configured to cover an edge of the conductive pad and configured to align a semiconductor chip package on the conductive pad;
- and
- a plurality of devices associated with the socket housing that are configured to couple the floating guide and the socket housing.
Dependencies are inferred from the claim text.