Connectors providing haptic feedback

#The present disclosure relates to electronic devices and more specifically to connectors for electronic devices.

#Advances in semiconductor manufacturing and circuit design technologies have enabled the development and production of integrated circuits (ICs) with increasingly higher operational frequencies. In turn, electronic products and systems incorporating such integrated circuits are able to provide much greater functionality than previous generations of products. This additional functionality has generally included the processing of increasingly larger amounts of data at increasingly higher speeds.

#Many electronic systems include multiple printed circuit boards (PCBs) upon which these high-speed ICs are mounted, and through which various signals are routed to and from the ICs. In electronic systems with at least two PCBs and the need to communicate information between those PCBs, a variety of connector and backplane architectures have been developed to facilitate information flow between the boards. Unfortunately, such connector and backplane architectures introduce a variety of impedance discontinuities into the signal path, resulting in a degradation of signal quality or integrity. Connecting to boards by conventional means, such as signal-carrying mechanical connectors, generally creates discontinuities, requiring expensive electronics to negotiate. Conventional mechanical connectors may also wear out over time, require precise alignment and manufacturing methods, and are susceptible to mechanical jostling.

#Having thus described the invention in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and wherein:

#FIG. 1 illustrates a general connector system,

#FIG. 2 illustrates structural components of a first connector,

#Illustrative embodiments now will be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of connectors and connector systems are shown. Indeed, connectors and connector systems may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that one skilled in the art can make and use the connectors and connector systems disclosed. Like numbers refer to like elements throughout.

#Connectors interconnect electronic devices and provide a pathway for signal and/or power transfer. Data transfer may be at very high rates. Connector systems are preferably easily manufactured, modular, and efficient. Examples of communication systems are disclosed in U.S. Pat. No. 5,621,913 and U.S. patent application Ser. No. 12/655,041. The disclosures of these and all other publications referenced herein are incorporated by reference in their entirety for all purposes.

#In today's society and ubiquitous computing environment, high-bandwidth modular and portable memory devices are being used increasingly. Security and stability of communication between and within these devices is important. In order to provide improved secure high-bandwidth communications, EHF communication units may be utilized. An example of an EHF communications unit is an EHF comm-link chip. Throughout this disclosure, the terms comm-link chip, comm-link chip package, and EHF communication link chip package will be used to refer to EHF antennas embedded in IC packages. Examples of such comm-link chips are described in detail in U.S. Patent Application Publication Nos. 2012/0263244; and 2012/0307932, both of which are hereby incorporated in their entireties for all purposes. Comm-link chips are an example of a communication device, also referred to as communication unit, whether or not they provide wireless communication and whether or not they operate in the EHF frequency band.