Lighting apparatus having improved light output uniformity and thermal dissipation
AssigneeTSMC Solid State Lighting Ltd.
InventorsPei-Wen Ko, Wei-Yu Yeh
Life of this patent
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AssigneeTSMC Solid State Lighting Ltd.
InventorsPei-Wen Ko, Wei-Yu Yeh
Estimating the term…
The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup.
An apparatus, comprising:
A lamp, comprising:
A lighting module, comprising:
Dependencies are inferred from the claim text.