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US 8,939,346 B2Granted
Methods and systems involving soldering
AssigneeInternational Business Machines Corporation
InventorJulien Sylvestre
Life of this patent
Estimating the term…
Abstract
A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency.
Claims20
A method comprising;
- arranging a planar surface of a semiconductor device and a planar surface of a substrate substantially in parallel such that separate solder portions arranged on conductive pads of the semiconductor device are aligned with corresponding separate solder portions arranged on conductive pads of the substrate, at least one of the separate solder portions arranged on the conductive pads of the substrate and at least one of the separate solder portions arranged on the conductive pads of the semiconductor device defining a gap therebetween, and such that at least another one of the separate solder portions arranged on the conductive pads of the substrate and at least another one of the separate solder portions arranged on the conductive pads of the semiconductor device are in contact with each other;
- heating the arranged semiconductor device and the substrate to liquefy the separate solder portions arranged on the conductive pads of the semiconductor device and the separate solder portions arranged on the conductive pads of the substrate;
- estimating a frequency in accordance with a number of the separate solder portions arranged on conductive pads of the semiconductor device that have liquefied and a mass of the semiconductor device;
- and
- exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at the frequency to close the gap between the at least one of the separate solder portions arranged on the conductive pads of the substrate and the at least one of the separate solder portions arranged on a conductive pads of the semiconductor device to form a bond therebetween.
2 more elements
A method comprising:
- applying solder to a plurality of conductive pads of a semiconductor device;
- applying solder to plurality of conductive pads of a substrate, wherein each conductive pad of the plurality of conductive pads of the substrate corresponds to a conductive pad of the plurality of conductive pads of the semiconductor device;
- aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, wherein a gap is defined between at least one of the portions of the solder arranged on the substrate that is not in contact with any portion of solder arranged on the semiconductor device to form an arrangement of the semiconductor device and the substrate wherein a planar surface of the semiconductor device and a planar surface of the substrate are arranged substantially in parallel;
- heating the semiconductor device and the substrate to liquefy the solder forming a conductive bond between at least one of the solder on the semiconductor device and at least one of the solder on the substrate;
- estimating a resonance frequency in accordance with a number of the portions of the solder on the semiconductor device that have liquefied and a mass of the semiconductor device;
- exerting an oscillating force on the arrangement in accordance with the resonance frequency exerted to result in a relative motion between the semiconductor device and the substrate in a direction that is substantially normal to the planar surface of the semiconductor device following the heating of the semiconductor device and the substrate;
- and
- forming a conductive bond between the at least one of the portions of the solder arranged on the substrate that was not in contact with any portion of solder arranged on the semiconductor device responsive to exerting the oscillating force.
5 more elements
A method comprising:
- arranging a planar surface of a semiconductor device and a planar surface of a substrate substantially in parallel such that solder portions disposed on respective conductive pads of the semiconductor device are arranged in an alignment with solder portions disposed on respective conductive pads of the substrate and such that at least one of the solder portions disposed on the respective conductive pads of the substrate is in contact with at least one of the solder portions disposed on the respective conductive pads of the semiconductor and such that at least another one of the solder portions disposed on the respective conductive pads of the substrate and at least another one of the solder portions disposed on the respective conductive pads of the semiconductor device define a gap therebetween;
- heating the semiconductor device and the substrate while arranged in the alignment to liquefy the solder portions arranged on the conductive pads of the semiconductor device and the solder portions arranged on the conductive pads of the substrate;
- estimating a frequency in accordance with a number of the solder portions arranged on conductive pads of the semiconductor device that have liquefied and a mass of the semiconductor device;
- and
- exerting an oscillating force following the heating while the semiconductor device and the substrate are arranged in the alignment that is operative to oscillate the semiconductor device relative to the substrate at the frequency to close the gap such that the at least one of the solder portions arranged on the conductive pads of the substrate and the at least one of the solder portions arranged on a conductive pads of the semiconductor device form a bond therebetween.
2 more elements
Dependencies are inferred from the claim text.