US 8,939,238 B2 · High quality PCD compact

Abstract

A sintered cutting element including a superabrasive layer supported on a substrate. The superabrasive layer includes superabrasive material and secondary phase, and the substrate includes a binder phase. The sintered cutting element is formed by a high temperature high pressure sintering process in which separate source elements melt and sweep first through the superabrasive layer, and then to the substrate to form the secondary phase and binder phase. The superabrasive layer is substantially free of or free of eta-phase, Co3W3C. Further, the portion of the substrate nearest the interface between the superabrasive layer and the substrate has equal or more binder phase than portions of the substrate further from the interface. In certain embodiments, the superabrasive material includes polycrystalline diamond, and the substrate includes cobalt tungsten carbide.

Claims24

Dependent claims

A cutting element, comprising:

a superabrasive layer comprising polycrystalline diamond (PCD) and a secondary phase, and
a substrate comprising tungsten carbide and a binder phase supporting the superabrasive layer, wherein the superabrasive layer has eta-phase, Co3W3C, as determined by XRD analysis wherein an XRD peak height of the <511> eta-phase peak (at a nominal d-spacing of 2.13 Å), after background correction, which peak height is 0.015 or less than 0.015 but greater than 0 when expressed as a fraction of the peak height of the <200> cubic cobalt peak (Ieta:ICo).

Dependencies are inferred from the claim text.

High quality PCD compact

Life of this patent

High quality PCD compact

Life of this patent

Abstract

Claims24