Apparatus and methods for filament crimping and manufacturing

A crimped filament assembly, comprising:

• at least one crimp element assembly, said at least one crimp element assembly comprising:
• a plurality of crimp heads, each of said crimp heads comprising:
• a first plurality of cavities, said first plurality of cavities disposed at a spacing which creates a first plurality of features;
• and
• a second plurality of cavities, said second plurality of cavities disposed at a spacing which creates a second plurality of features;
• wherein said first and second pluralities of cavities are substantially opposite to, yet substantially offset from, one another when said crimp head is crimped, thereby forming a substantially serpentine channel therebetween for receiving a filament;
• and
• a filament, at least two of said crimp heads being crimped to said filament;
• and
• a carrier, said carrier facilitating the automated processing of said at least one crimp element assembly.

A method of manufacturing a crimped filament assembly comprising a plurality of crimp heads each comprising a first metal alloy with a plurality of crimping cavities configured to retain a filament wire therein, a filament comprising a second metal alloy, and a carrier that facilitates automated processing of the assembly, the assembly manufactured according to the method comprising:

• disposing the plurality of crimp heads on the carrier in a substantially longitudinal and aligned orientation;
• disposing said filament in the crimping cavities of at least two of the plurality of crimp heads;
• placing at least a portion of the filament between the at least two crimp heads under tension;
• crimping said at least two crimp heads so as to form said assembly;
• disposing said crimped assembly onto a polymer carrier;
• and
• securing said crimped assembly to said polymer carrier utilizing an adhesive, said adhesive configured so as to not leave any residue on said portions of said crimped assembly that are in contact with said adhesive.