Method of mounting a circuit board
AssigneeAdvanced Micro Devices, Inc.
InventorsStephen F. Heng, Mahesh S. Hardikar
Life of this patent
Estimating the term…
Abstract
Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion of the circuit board. The support structure includes a plurality of nested frames. In another aspect, a socket with a with socket cover coupled to a socket housing is disclosed. The socket housing includes a support structure to support a portion of the socket cover.
Claims17
A method of mounting a circuit board, comprising:
- placing the circuit board in a socket, the socket including a socket cover coupled to a socket housing, the socket housing having a first surface with plural cavities and a first support structure projecting away from the first surface and adapted to support a portion of the socket cover, the first support structure including a first plurality of nested frames;
- and
- securing the circuit board to the socket.
A method of manufacturing, comprising:
- forming a socket operable to receive a circuit board, the socket including a socket cover coupled to a socket housing, the socket housing having a first surface with plural cavities and a first support structure projecting away from the first surface and adapted to support a portion of the socket cover, the first support structure including a first plurality of nested frames.
Dependencies are inferred from the claim text.