Method of manufacturing semiconductor device
AssigneePS4 Luxco S.a.r.l.
InventorsKatsushi Takano, Hiroaki Izumi, Kanji Sugino
Life of this patent
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Abstract
A method of manufacturing a semiconductor device may include, but is not limited to the following processes. A first group identifier allocated to a first group of semiconductor wafers is detected. The first group of semiconductor wafers includes a first semiconductor wafer to be processed first among the first group. A first processor of a plurality of processors, which process respective ones of the first group of semiconductor wafers, are determined based on the first group identifier. The first processor is used for processing the first semiconductor wafer. The first semiconductor wafer is supplied to the first processor.
Claims18
A method of manufacturing a semiconductor device, comprising:
- obtaining a first group identifier allocated to a first group of semiconductor wafers, the first group of semiconductor wafers comprising a first semiconductor wafer and a second semiconductor wafer;
- determining, based on information related to the first group identifier stored by a storage, a first processor of a plurality of processors, the first processor being used for processing the first semiconductor wafer;
- supplying the first semiconductor wafer to the first processor, the first semiconductor wafer being supplied first among the first group;
- and
- supplying the second semiconductor wafer to a second processor of the plurality of processors, the second processor being other than the first processor, to thereby enable the first and second semiconductor wafers to be processed in parallel by the first and second processors, respectively.
A method of manufacturing a semiconductor device, comprising:
- obtaining a first group identifier allocated to a first group of semiconductor wafers, the first group of semiconductor wafers being housed in slots that are numbered;
- and
- determining, based on information related to the first group identifier and stored in a storage, for each of the first group of semiconductor wafers, a corresponding processor of a plurality of processors for supplying each wafer to the corresponding processor, to thereby enable each of the first group of semiconductor wafers to be processed in parallel by the corresponding processor of the plurality of processors.
A method of manufacturing a semiconductor device using a wafer processing system comprising a plurality of processors, the method comprising:
- processing a first semiconductor wafer in a first processor among a plurality of processors of the wafer processing system, the first semiconductor wafer being included in a first group of semiconductor wafers, and the first semiconductor wafer being supplied first among the first group of semiconductor wafers;
- storing, in a storage, a first identifier that identifies the first processor which has processed the first semiconductor wafer;
- determining the first processor for processing again the first semiconductor wafer, based on the first identifier;
- and
- processing a second semiconductor wafer in a second processor among the plurality of processors of the wafer processing system, the second semiconductor wafer being included in the first group of semiconductor wafers,
- wherein the first and second semiconductor wafers are processed in parallel to each other in the first and second processors respectively.
Dependencies are inferred from the claim text.