Integrated circuit combination of a target integrated circuit and a plurality of photovoltaic cells connected thereto using the top conductive layer

An integrated circuit, comprising:

• a target integrated circuit (TIC);
• a plurality of thin-film photovoltaic (PV) cells manufactured over at least one of a top surface and a bottom surface of the TIC, each PV cell of the plurality of PV cells having an upper connectivity layer (UCL) and a lower connectivity layer (LCL);
• a first group of a plurality of conducting paths connecting at least a first portion of the plurality of PV cells by their respective LCL and UCL to form a first array of PV cells providing a first voltage, wherein the first portion of the plurality of PV cells are arranged in the first array of PV cells, such that in each column of the first array of PV cells, adjacent PV cells are connected in series using a conducting path connecting at least a UCL of a first PV cell directly to the top surface of the target integrated circuit (TIC) and from the top surface of the target integrated circuit (TIC) directly to a LCL of a second PV cell of the two adjacent PV cells;
• and
• a second group of the plurality of conducting paths connecting at least a second portion of the plurality of PV cells by their respective LCL and UCL to form a second array of PV cells, wherein LCLs of a group of PV cells in the first array are connected to UCLs of a group of PV cells in the second array to provide a second voltage, wherein the second portion of the plurality of PV cells are arranged in the second array of PV cells, such that in each column of the second array of PV cells, adjacent PV cells are connected in series using a conducting path connecting at least a UCL of a first PV cell to the top surface of the target integrated circuit (TIC) and from the top surface of the target integrated circuit (TIC) to a LCL of a second PV cell of the two adjacent PV cells.