# US 8,921,879 B2 · Optical device and method for manufacturing same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,921,879 B2 - Document ID: US8921879B2 - Status: Granted - Kind: B2 - Application number: 13/583,559 - Filed: 2011-03-30 - Published: 2013-02-14 - Granted: 2014-12-30 - Earliest claimed: 2010-03-31 - Assignees: Point Engineering Co., Ltd. - Applicants: Ki Myung Nam; Tae-Hwan Song; Young-Chul Jun - Inventors: Ki Myung Nam; Tae-Hwan Song; Young-Chul Jun - Web page: https://patentgrep.com/patent/US8921879B2 ## CPC - H10W 90/00: Package configurations - H05K 1/05: Insulated {conductive substrates, e.g. insulated} metal substrate - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/8585: {being an interconnection} - H10H 20/036: {of packages} - H10H 20/0364: {of interconnections} - H10H 20/0365: {of means for heat extraction or cooling} - H10H 20/8506: {Containers} - H10H 20/8582: {characterised by their shape} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/753: {between laterally-adjacent chips} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate. ## Claims ### Claim 1 An optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate, wherein the substrate comprises: a plurality of conductive bulks which are arranged in at least one column direction; a penetrating insulation member disposed between the plurality of conductive bulks, wherein the penetrating insulation member further includes insulative fixing members disposed on the top and the bottom thereof and covering the plurality of conductive bulks; and at least one conductive layer formed on upper surfaces of the plurality of conductive bulks. ### Claim 2 (depends on 1) The optical device according to claim 1, wherein the plurality of light emitting chips are attached to the at least one conductive layer by means of a conductive adhesive and connected to another adjacent conductive layer by means of the conductive wires. ### Claim 3 (depends on 1) The optical device according to claim 1, wherein the conductive layer is formed on upper surfaces of the plurality of conductive bulks by means of any one selected from among an electroless plating process, an electrolytic plating process, a paste process and an ink printing process. ### Claim 4 (depends on 1) The optical device according to claim 1, further comprising terminal layers formed on upper, lower or lateral surfaces of at least one of the plurality of conductive bulks. ### Claim 5 (depends on 1) The optical device according to claim 1, further comprising an insulation layer or a radiation plate disposed on a lower surface of at least one of the plurality of conductive bulks. ### Claim 6 (depends on 1) The optical device according to claim 1, wherein the plurality of conductive bulks include a plurality of protrusions formed on upper surfaces thereof. ### Claim 7 (depends on 1) The optical device according to claim 1, wherein the number of the conductive bulks in a row direction and the number of the conductive bulks in a column direction are the same or different from each other. ### Claim 8 (depends on 1) The optical device according to claim 1, wherein the plurality of light emitting chips are arranged in at least one row direction and at least one column direction, and the number of the light emitting chips in a row direction and the number of the light emitting chips in a column direction are the same as or different from each other. ### Claim 9 (depends on 1) The optical device according to claim 1, further comprising a barrier formed on the substrate such that the barrier surrounds the protective layer. ### Claim 10 (depends on 9) The optical device according to claim 9, wherein the barrier has a rectangular or circular shape when viewed in a plan. ### Claim 11 (depends on 1) The optical device according to claim 1, wherein the protective layer has a convex lens shape which is convex when viewed in cross-section. ### Claim 12 (depends on 1) The optical device according to claim 1, wherein the plurality of light emitting chips are separately covered with the protective layer, and the protective layer separately covering the light emitting chips is covered with a dome-shaped lens composed of an encapsulant. ### Claim 13 (depends on 1) The optical device according to claim 1, wherein the penetrating insulation member comprises a plurality of penetrating insulation members disposed between the plurality of conductive bulks; and wherein the substrate further comprises an insulation layer formed on an upper surface of at least one of the plurality of conductive bulks. ### Claim 14 (depends on 13) The optical device according to claim 13, wherein the plurality of light emitting chips are attached to the insulation layer, and wherein the light emitting chips are connected to each other by means of the conductive wires and the light emitting chips and the conductive layer are connected to each other by means of the conductive wires. ### Claim 15 (depends on 1) The optical device according to claim 1, wherein the substrate comprises: an insulation layer formed on an upper surface of at least one of the conductive bulks; a plurality of electrode layers formed on a surface of the insulation layer; and a plurality of terminal layers formed on a surface of the insulation layer. ### Claim 16 (depends on 15) The optical device according to claim 15, wherein the plurality of light emitting chips are attached to the electrode layers by means of a conductive adhesive, and the plurality of conductive wires connect the light emitting chips to the electrode layers, the light emitting chips to the terminal layers, and the electrode layers to the light emitting chips. ### Claim 17 (depends on 15) The optical device according to claim 15, wherein the electrode layers are formed on upper surfaces of the insulation layer by means of any one selected from among an electroless plating process, an electrolytic plating process, a paste process and an ink printing process. ### Claim 18 An optical device comprising: a substrate including a plurality of conductive bulks which are arranged in at least one row direction and at least one column direction, a penetrating insulation member disposed between the plurality of conductive bulks, wherein the penetrating insulation member further includes insulative fixing members disposed on the top and the bottom thereof and covering the plurality of conductive bulks, and at least one conductive layer formed on upper surfaces of the plurality of conductive bulks; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate. ### Claim 19 (depends on 18) The optical device according to claim 18, wherein the plurality of light emitting chips are attached to the at least one conductive layer by means of a conductive adhesive and connected to another adjacent conductive layer by means of the conductive wires. ### Claim 20 (depends on 18) The optical device according to claim 18, further comprising terminal layers formed on upper, lower or lateral surfaces of at least one of the plurality of conductive bulks. ### Claim 21 (depends on 18) The optical device according to claim 18, further comprising an insulation layer or a radiation plate disposed on a lower surface of at least one of the plurality of conductive bulks. ### Claim 22 (depends on 18) The optical device according to claim 18, wherein the plurality of conductive bulks include a plurality of protrusions formed on upper surfaces thereof. ### Claim 23 (depends on 18) The optical device according to claim 18, further comprising a barrier formed on the substrate such that the barrier surrounds the protective layer.