US 8,921,165 B2 · Elimination of silicon residues from MEMS cavity floor

Abstract

The present invention generally relates to a MEMS device in which silicon residues from the adhesion promoter material are reduced or even eliminated from the cavity floor. The adhesion promoter is typically used to adhere sacrificial material to material above the substrate. The adhesion promoter is the removed along with then sacrificial material. However, the adhesion promoter leaves silicon based residues within the cavity upon removal. The inventors have discovered that the adhesion promoter can be removed from the cavity area prior to depositing the sacrificial material. The adhesion promoter which remains over the remainder of the substrate is sufficient to adhere the sacrificial material to the substrate without fear of the sacrificial material delaminating. Because no adhesion promoter is used in the cavity area of the device, no silicon residues will be present within the cavity after the switching element of the MEMS device is freed.

Claims14

Dependent claims

A method of fabricating a MEMS device, comprising:

depositing an adhesion layer over a substrate having a first portion to be enclosed within a cavity and a second portion to be disposed outside the cavity;
removing the adhesion layer in the area disposed over the first portion;
depositing a sacrificial layer on and in contact with the adhesion layer and the first portion of the substrate;
forming a switching element above the sacrificial layer;
enclosing the switching element within the cavity;
and
removing the sacrificial layer.

4 more elements

Dependencies are inferred from the claim text.

Elimination of silicon residues from MEMS cavity floor

Life of this patent

Elimination of silicon residues from MEMS cavity floor

Life of this patent

Abstract

Claims14