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US 8,918,971 B2Granted
Method of manufacturing packages
AssigneeSII Crystal Technology Inc.
InventorJunya Fukuda
Life of this patent
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Abstract
A method of manufacturing packages having contents sealed therein, including: a step of forming cavities in a plurality of package forming areas on a first wafer; a step of bonding the first wafer and a second wafer while arranging the contents in the cavities; and a step of irradiating a bonded wafer member with a laser and separating the packages into pieces, characterized in that dummy cavities are formed on an outside of the package forming area in an outermost periphery of the first wafer in the cavity forming step.
Claims5
A method of manufacturing packages having components sealed therein, the method comprising:
- forming an array of device cavities in a package area on a first wafer;
- bonding the first wafer and a second wafer and enclosing the components in the device cavities to form an array of component packages in a bonded wafer member;
- and
- irradiating the bonded wafer member with a laser and separating the packages,
- wherein forming device cavities further comprises forming dummy cavities outside of an outer perimeter of the array and in an outermost periphery of the first wafer, such that upon bonding the first wafer and the second wafer the dummy cavities are empty, the dummy cavities devoid of components and having substantially the same structure as the device cavities.
2 more elements
Dependencies are inferred from the claim text.