Manufacturing method for monolithic ceramic electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsTogo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
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Abstract
In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.
Claims6
A manufacturing method for a monolithic ceramic electronic component, comprising the steps of:
- preparing a mother block including a plurality of ceramic green sheets that are stacked on each other, and an internal electrode pattern arranged along each of a plurality of interfaces between the ceramic green sheets;
- performing a first cutting including cutting the mother block along a first cutting line to obtain a plurality of rod-shaped green block bodies, the rod-shaped green block bodies each having a laminated structure including a plurality of ceramic layers and a plurality of internal electrodes that are in a raw state, the internal electrodes being exposed on a cut side surface that is produced by cutting along the first cutting line;
- applying a ceramic paste to the cut side surface to form a raw ceramic protective layer;
- performing a second cutting including cutting each of the rod-shaped green block bodies on which the raw ceramic protective layer has been formed along a second cutting line extending in a direction perpendicular or substantially perpendicular to the first cutting line to obtain a plurality of raw component bodies that are each a component body in a raw state;
- and
- firing each of the raw component bodies;
- wherein
- the applying step includes the steps of:
- preparing an application plate that holds the ceramic paste;
- bringing the ceramic paste held by the application plate into contact with the cut side surface of each of the rod-shaped green block bodies;
- and
- transferring the ceramic paste to the cut side surface of each of the rod-shaped green block bodies, by moving each of the rod-shaped green block bodies and the application plate relative to each other in a direction in which the cut side surface extends while separating each of the rod-shaped green block bodies from the application plate in a state in which the ceramic paste is connected to both of each of the rod-shaped green block bodies and the application plate.
Dependencies are inferred from the claim text.