Multiple die communication system
AssigneeNokia Corporation
InventorsTommi Kanerva, Pasi Kolinummi, Mika Koikkalainen
Life of this patent
Estimating the term…
Loading patent…
AssigneeNokia Corporation
InventorsTommi Kanerva, Pasi Kolinummi, Mika Koikkalainen
Estimating the term…
Suitably arranged circuits located on a die surface of respective multiple dies are operatively connected via a physical link, which is configured for full-duplex operation. Data information content is transferred between the operatively connected suitably arranged circuits via the full-duplex physical link which is configured as a fragmented data interconnected (FDI) physical link allowing peer-to-peer operation and pipelining. The data information content is carried in data fragments by a self-contained data packet structure. In one embodiment a device comprises a first suitably arranged and configured circuit located on a die surface, a second suitably arranged and configured circuit located on a die surface and a full-duplex physical link arranged and configured for operatively connecting the first circuit located on the die surface to the second circuit located on the die surface for transferring data information content between the first circuit and the second circuit.
A method, comprising:
A device, comprising:
A device, comprising:
A device, comprising:
Dependencies are inferred from the claim text.