Heat radiation device and electronic equipment using the same
AssigneePanasonic Corporation
InventorsYasuhito Fukui, Takashi Sawa, Shinichi Shinohara
Life of this patent
Estimating the term…
Abstract
Disclosed is a heat radiation device, which is in contact with a first heat-producing component having a higher value of guaranteed temperature and a second heat-producing component having a lower value of guaranteed temperature, and the heat radiation device comprises a metal member provided with a slit. The metal member is divided by the slit to have two heat radiation regions, a first heat radiation region and a second heat radiation region that are loosely coupled with each other in terms of heat conduction. The first heat-producing component is placed in contact with the first heat radiation region, and the second heat-producing component is placed in contact with the second heat radiation region.
Claims8
A heat radiation device comprising a metal member provided with an opening, the opening dividing the metal member into a first heat radiation region and a second heat radiation region loosely coupled with each other in terms of heat conduction, wherein:
- the first heat radiation region is in contact with a first heat-producing component,
- the second heat radiation region is in contact with a second heat-producing component,
- a maximum allowable operating temperature of the first heat-producing component is higher than a maximum allowable operating temperature of the second heat-producing component,
- a heat dissipating capacity of the second heat radiation region is higher than a heat dissipating capacity of the first heat radiation region,
- the metal member includes one or more fins in each of the first and second heat radiation regions, and
- the second heat radiation region includes a greater number of fins than the first heat radiation regions.
An electronic equipment comprising:
- a first heat-producing component having a first maximum allowable operating temperature;
- a second heat-producing component having a second maximum allowable operating temperature;
- and
- a heat radiation device including a metal member with an opening, the opening diving the metal member into a first heat radiation region and a second heat radiation region loosely coupled with each other in terms of heat conduction, wherein:
- the first heat radiation region is in contact with the first heat-producing component,
- the second heat radiation region is in contact with the second heat-producing component,
- the first maximum allowable operating temperature of the first heat-producing component is higher than the second maximum allowable operating temperature of the second heat-producing component,
- a heat dissipating capacity of the second heat radiation region is higher than a heat dissipating capacity of the first heat radiation region,
- the metal member includes one or more fins in each of the first and second heat radiation regions, and
- the second heat radiation region includes a greater number of fins than the first heat radiation regions.
An electronic component comprising:
- a heat radiation device having a first heat radiation portion and a second heat radiation portion that are loosely coupled with each other in terms of heat conduction, the first heat radiation portion and the second heat radiation portion having different heat dissipating capacities;
- a first heat-producing component in contact with the first heat radiation portion;
- and
- a second heat-producing component in contact with the second heat radiation portion, wherein:
- a maximum allowable operating temperature of the first heat-producing component is higher than a maximum allowable operating temperature of the second heat-producing component,
- the first heat radiation portion includes a first metal member and a first heat conductive member,
- the second heat radiation portion includes a second metal member and a second heat conductive member, and
- a thermal conductivity of the first heat conductive member is smaller than a thermal conductivity of the second heat conductive member.
Dependencies are inferred from the claim text.