US 8,913,386 B2 · Cooling module for cooling electronic components

Abstract

A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.

Claims23

Dependent claims

A cooling module for cooling at least one electronic and/or electric component, the cooling module comprising:

a condenser including at least two panels that are forming fins which are exposable to an airflow through the fins, each of the at least two panels having two sheets that are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets extending in a direction of a plane formed by the sheets;
and
wherein the at least two panels that are forming fins that are arranged such that a cooling air passage is formed between the fins for receiving the airflow through the fins.

A method of cooling electric and/or electronic components, the method comprising:

receiving heat from at least one electric and/or electronic component thermally connected to a heat receiving unit of a cooling module by the heat receiving unit in an operating state of the cooling module;
transferring heat in an operating state of the cooling module from the heat receiving unit to a condenser of the cooling module, the condenser having at least two panels that are forming fins which are exposable to an airflow through the fins, each of the at least two panels including a panel having two sheets that are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets extending in a direction of a plane formed by the sheets;
and
wherein the at least two panels that are forming fins that are arranged such that a cooling air passage is formed between the fins for receiving the airflow through the fins.

1 more element

Dependencies are inferred from the claim text.

Cooling module for cooling electronic components

Life of this patent

Cooling module for cooling electronic components

Life of this patent

Abstract

Claims23