Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)

A cooled electronic system comprising:

• an electronic assembly, the electronic assembly comprising:
• an electronics card comprising a first side and a second side, the first side and the second side being opposite sides of the electronics card;
• a socket for receiving the electronics card;
• and
• a cooling apparatus comprising a thermal transfer structure mounted to the electronic assembly and configured and positioned to engage the electronics card with docking of the electronics card within the socket, wherein the electronics card is docked or undocked from the socket, independent of the thermal transfer structure, the thermal transfer structure comprising:
• a thermal spreader comprising a first thermal conduction surface;
• a thermally conductive spring assembly secured to the thermal spreader and positioned and configured for operative docking or undocking of the electronics card into or from the socket of the electronic assembly, without removal of the thermal transfer structure from the electronic assembly, and to reside between and physically couple the first side of the electronics card to the first thermal conduction surface of the thermal spreader with docking of the electronics card within the socket, and thereby facilitate conduction of heat from the electronics card to the thermal spreader;
• and
• wherein the electronics card comprises multiple electronic components mounted to the first side thereof, and wherein the thermally conductive spring assembly of the thermal transfer structure comprises a plurality of compression springs, the plurality of compression springs being spaced along the first thermal conduction surface of the thermal spreader, and one or more compression springs of the plurality of compression springs each being sized and configured to independently, physically engage with a spring force, two or more respective electronic components of the multiple electronic components mounted to the first side of the electronics card with the docking of the electronics card in the socket.

A method of fabricating a cooled electronic system, the method comprising:

• providing an electronic assembly, the electronic assembly comprising:
• an electronics card comprising a first side and a second side, the first side and the second side being opposite sides of the electronics card;
• and
• a socket accommodating docking or undocking of the electronics card therein;
• providing a coolant-cooled structure at one end of the socket, the coolant-cooled structure comprising a thermally conductive structure with at least one coolant-carrying channel extending therein;
• and
• providing a first thermal transfer structure and a second thermal transfer structure mounted to the electronic assembly and configured to engage the first side and the second side of the electronics card, respectively, with docking of the electronics card within the socket, the electronics card being docked or undocked from the socket, independent of the first thermal transfer structure and second thermal transfer structure, and the first thermal transfer structure and the second thermal transfer structure being secured to the coolant-cooled structure and facilitating transfer of heat from the electronics card to the coolant-cooled structure, the first thermal transfer structure comprising a first thermally conductive spring assembly coupled to a first thermal conduction surface of a first thermal spreader thereof, and the second thermal transfer structure comprising a second thermally conductive spring assembly coupled to a second thermal conduction surface of a second thermal spreader thereof, wherein the first and second thermally conductive spring assemblies are positioned and configured for operative docking or undocking of the electronics card into or from the socket, without removal of the first thermal transfer structure or second thermal transfer structure, and to reside between and physically engage the first side and the second side, respectively, of the electronics card with docking of the electronics card within the socket, and thereby facilitate conduction of heat from the electronics card through the first thermal transfer structure and the second thermal transfer structure to coolant within the coolant-cooled structure;
• and
• wherein the electronics card comprises multiple electronic components mounted to the first side thereof, and multiple electronic components mounted to the second side thereof, and wherein the first thermal transfer structure comprises a first plurality of compression springs secured to the first thermal conduction surface of the first thermal spreader, and the second thermal transfer structure comprises a second plurality of compression springs secured to the second thermal conduction surface of the second thermal spreader, the first plurality of compression springs being spaced along the first thermal conduction surface of the first thermal spreader, and the second plurality of compression springs being spaced along the second thermal conduction surface of the second thermal spreader, and one or more compression springs of each one of the first and second pluralities of compression springs each being sized and configured to independently, physically engage with a spring force, two or more respective electronic components of the multiple electronic components mounted to each of the first and second sides of the electronics card with docking of the electronics card in the socket.