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US 8,913,221 B2Granted
Display device
AssigneeSharp Kabushiki Kaisha
InventorHiroyuki Moriwaki
Life of this patent
Estimating the term…
Abstract
A groove is formed above a first group of interconnects of a first substrate, continuously extending along a substrate outer perimeter portion and across the first group of interconnects. An underlying metal is provided in the same layer in which a second group of interconnects are provided, below the groove in at least regions in which the groove overlaps the first group of interconnects as viewed from above.
Claims17
A display device wherein
- a first substrate and a second substrate are provided, facing each other,
- the first substrate includes a substrate body, a first group of interconnects provided on the substrate body and including a gate line and a source lead interconnect that are made of a first metal, and a second group of interconnects provided with an insulating film being interposed between the first and second groups of interconnects and including a source line and an underlying metal that are made of a second metal,
- in a display region, the first group of interconnects extending in parallel to each other and the second group of interconnects extending in parallel to each other in a direction intersecting the first group of interconnects are provided, and pixels are provided, corresponding to switching elements each provided in the vicinity of a corresponding one of intersections of the first and second groups of interconnects as viewed from above, to display an image,
- on the source lead interconnect of the first substrate, the insulating film, the underlying metal, a passivation film, and a planarization film are sequentially provided in this order,
- a groove is provided in a region of the planarization film and the passivation film on a substrate outer perimeter portion including the underlying metal on the source lead interconnect, continuously extending along the substrate outer perimeter portion and across the first group of interconnects,
- a contact hole is provided in the source lead interconnect and the insulating film and the passivation film on the second group of interconnects, and
- a conductive film is provided on the contact hole electrically connecting the source lead interconnect and the second group of interconnects.
4 more elements
Dependencies are inferred from the claim text.