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US 8,912,959 B2Granted
Packaging structure and method of fabricating the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang
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Abstract
A packaging structure and a method of fabricating the same are provided. The packaging structure includes a substrate, first packaging element disposed on the substrate, a second packaging element disposed on the substrate and spaced apart from the first packaging element, a first antenna disposed on the first packaging element, and a metal layer formed on the second packaging element. The installation of the metal layer and the antenna enhances the electromagnetic shielding effect.
Claims22
A packaging structure, comprising:
- a substrate;
- a first packaging element disposed on the substrate;
- a second packaging element disposed on the substrate and spaced apart from the first packaging element;
- a first antenna formed on the first packaging element, wherein the second packaging element is free from being correspondingly formed with an antenna structure thereon;
- and
- an electromagnetic interference shield metal layer formed on the second packaging element, wherein the first packaging element is free from being correspondingly formed with an electromagnetic interference shield structure thereon.
3 more elements
A packaging structure, comprising:
- a substrate;
- a first packaging element disposed on the substrate;
- a second packaging element disposed on the substrate and spaced apart from the first packaging element;
- an electromagnetic interference shield metal layer formed on the first packaging element and the second packaging element, wherein the first packaging element is free from being correspondingly formed with an electromagnetic interference shield structure thereon;
- an encapsulant formed on a first portion of the electromagnetic interference shield metal layer formed on the first packaging element;
- at least a conductive hole formed in the encapsulant and having an end exposed from the encapsulant;
- and
- an antenna formed on the encapsulant and connected to the end of the conductive hole, wherein the second packaging element is free from being correspondingly formed with an antenna structure thereon.
5 more elements
A method, comprising:
- providing a package having a substrate, a first packaging element disposed on the substrate, and a second packaging element disposed on the substrate and spaced apart from the first packaging element;
- forming a metal layer on the first packaging element and the second packaging element, wherein the metal layer on the second packaging element is an electromagnetic interference shield metal layer, and the second packaging element is free from being correspondingly formed with an antenna structure thereon;
- and
- patterning a first portion of the metal layer that is formed on the first packaging element to form a first antenna on the first packaging element, wherein the first packaging element is free from being correspondingly formed with an electromagnetic interference shield structure thereon.
1 more element
A method, comprising:
- providing a package having a substrate, a first packaging element disposed on the substrate, and a second packaging element disposed on the substrate and spaced apart from the first packaging element;
- forming a metal layer on the first packaging element and the second packaging element, wherein the metal layer on the second packaging element is an electromagnetic interference shield metal layer, and the second packaging element is free from being correspondingly formed with an antenna structure thereon;
- forming an encapsulant on a first portion of the metal layer that is formed on the first packaging element;
- forming in the encapsulant at least a conductive hole that has a first end connected to the first portion of the metal layer and a second end exposed from the encapsulant;
- and
- forming on the encapsulant an antenna that is connected to the second end of the conductive hole, wherein the first packaging element is free from being correspondingly formed with an electromagnetic interference shield structure thereon.
3 more elements
Dependencies are inferred from the claim text.