Millimeter-wave bare IC mounted within a laminated PCB and usable in a waveguide transition

A system for interfacing between a millimeter-wave flip-chip and a laminate waveguide structure embedded inside a Printed Circuit Board (PCB), comprising:

• a cavity formed in the PCB, going through at least one lamina of the PCB;
• an electrically conductive pad inside the cavity, printed on a lamina under the cavity, wherein the lamina under the cavity forms a floor to the cavity;
• a flip-chip Integrated Circuit or a Solder-Bumped die, configured to output a millimeter-wave signal from a bump electrically connected with the electrically conductive pad, such that the flip-chip integrated Circuit or a Solder-Bumped die is located inside the cavity that is going through the at least one lamina of the PCB;
• a laminate waveguide structure embedded in laminas of the PCB, comprising a first electrically conductive surface printed on a lamina of the PCB above the floor of the cavity;
• a probe printed on the same lamina as the electrically conductive pad, located inside the laminate waveguide structure and under the first electrically conductive surface;
• and
• a transmission line signal trace printed as a continuation to the electrically conductive pad, the transmission line electrically connecting the bump of the signal to the probe;
• the system configured to guide a signal from the flip-chip or Solder-Bumped die, through the transmission line signal trace, into the laminate waveguide structure, and outside of the laminate waveguide structure.

A system enabling interface between a bare-die Integrated Circuit and a Printed Circuit Board (PCB), comprising:

• a cavity of depth X, formed in at least one lamina of the PCB;
• two electrically conductive pads, printed on one of the laminas of the PCB, the electrically conductive pads operative to substantially reach an edge of the cavity;
• a bare-die Integrated Circuit of thickness X, or a heightened bare-die Integrated Circuit of thickness X configured to output a millimeter-wave signal from two electrically conductive contacts arranged in a differential signal configuration on an upper side edge of the bare-die Integrated Circuit;
• the bare-die Integrated Circuit is placed inside the cavity such that the two electrically conductive pads and the upper side edge containing the two electrically conductive contacts are arranged side-by-side at substantially the same height;
• and
• two bonding wires or strips electrically connecting each electrically conductive contact to one of the electrically conductive pads;
• the system configured to transport a millimeter-wave signal from the electrically conductive contacts to the electrically conductive pads across the small distance formed between the electrically conductive contacts and the electrically conductive pads.